HL reported that the next version of the pulser should be in Paris next week.  They will also have a power supply.  They will test these in Paris.  The light/LED display has been put on the pulser box as per discussions with DS in June.
They need the final schamatic of the monitor board layout for drilling holes.  DH can send this next week, once the board is finalized.

MT asked about the B-field at the level of the pulser boxes.  The French group have tested the pulser in a 300 gauss field, in all directions, with no observable effects.  Orsay have also tested the fanout.  DH sees about 100-120 gauss in the top of the crates on the platform.
The original intent was to place the pulser box and PS in the top of the crate (3U each) but HL requested that he would prefer the bottom of the crate. Nothing prevents this at the moment but we need to let Fogelson know about this change.  The claim is that there is 6U available on top and at the bottom, not counting the BLS power supplies.
DS will also have a 2U fanout crate for the BLS control and another 1553 (taking up 1U) which he would like near the other fanout crate.  We now have 9/12 U taken up.

DH received the final version of the fanout.  Visual inspection showed that it looks fine, apart from a few mm difference in the height of some of the connectors. LG will install the fanout in the 5k test stand to make sure that there are no unforseen problems.  Orsay is ready to start production of the 70+ boards.

Several VME interface boards have been considered.  Two will be sent with BO when he comes to FNAL on Sept 13. DS will be at FNAL on Sept 15 (Wed) and they can test the interface boards then.  There is a possible third type that Paris does not have yet for testing.  Pipelining the data flow still needs to be worked out.

MT mentioned that on the current schedule, we start install of the pulser system Nov 11.  Paris thought this was still achievable.  MT suggested Paris makes sure that there are no customs problems for shipping any of the pieces.
 

DS has almost all the pieces for the BLS motherboard prototype - fully populated otherwise.  Not started testing the final version yet but soon.  He does have the modified daughter boards.  He will try and have a tested BLS board to bring to FNAL Oct 1.  This should be the final version.

DS has ordered 62,000 shaper hybrid circuits from MTI.  The PO is in the SUNYSB system (~$300k).  Once this is received, MTI promises 8-10 week delivery (i.e. probably end November).

The daughterboard evaluation and order of the production quantity (~6k) might be done by Oct 13 to meet MT's schedule.  The BLS motherboard can not go out for bid until the daughterboard is checked out.
 

DE has had problems compiling the test code due to either license problems or a bug in the compiler.  DS will try this out on another machine to try and see where the problem lies.
DE has been working on gate delays with a 6-bit encoder.

DH reported we have all 32 wafers of the 6" production   Supertech is storing the other 16 wafers they produced in case we want them later.  The wafers have been sent to be probed and this should be starting now (editor's note: From a message forwarded by DH on probing: 87% good of 24 wafers = 6156 chips and 84.9% good of 8 wafers = 2163 chips i.e. 8319 good chips.  The 16 wafers held back should nominally produce about 4100 good chips.).  The tested wafers will be shipped directly to Hong Kong for packaging.  The paperwork for this should be out Tue/Wed next week.  Packaging takes about 3 weeks i.e. should be done about Oct 6.

The 4" packaging is still stalled.  PL has told them that we don't have the information they requested on the bonding pads and has asked if they can proceed anyway.

A discussion about manpower ensued - we need manpower for testing SCAs among other things.  The estimate is that someone can get though about 1000 SCAs/week and we will have about 10k to test i.e. we need someone for about 2 months.  Can we get lab or contract help for this? MT will look into it.

LG reported that Shaohua Fu produced all the labels for the 4" production that we have in hand.  Again, we need help labelling the parts and entering them in the database.

PL reported that the burn-in test stand has been mover over to LB's workbench area, away from the soldering iron that was short circuiting it.  However a FPGA died in the process and had been replaced.  There are 49 SCAs burning in at the moment.  In the last group tested 1/49 came out bad from a 2 week burn-in period.  PL will try and get an estimate of MTBF for the SCAs that have been tested so far.

DH has a 2nd preamp PS running and has been playing with it a bit.  He is putting a monitor board in the pulser PS and checking into muon PSs.  All the modifications to the monitor board are done and the files are almost ready for shipping - just checking for bugs etc.  It was decided that prototypes should be made but the turn around time should be speeded up as much as possible.  2-5 days should be possible.  Bob Jones group can do the assembly - just need to get in their queue.  Oct 4 is a reasonable deadline to get these done by.  PL will work on the PO for both prototype and production to speed this up.
We have all the parts in for the calorimeter PS's, including shields and manifolds.  We might want to warn other groups (muons etc) that they need to get parts for their boards and supplies.
DH has a silk screen design for the front panel which needs to be sent out - this does not hold up production.
PL will be in South Bend, IN in a couple of weeks and suggests he can visit Chipco to check on their facilities.

Estimate that can get all 25 supplies done by end October. We will need both bench space and some help with assembly - Don Emory may be available.

After this we need a safe way to get PS up on the detector platforms - should write up a safety & hazards procedure. We will need help from Del Miller's group for craning the supplies up. We will probably put the PS in the steel boxes before craning up. Handles need to be put on the supplies for future removal and reinstallation. Expect to start installing mid-October.

LB has a fax from DeWayne Hill of LaTech which she will forward to DS.  They have changed some resistors to change the rise time of the PMT signals.  DS will contact LaTech and discuss it with them.
 

The Blazey Liquid Argon monitoring box needs to be modified to be able to close the platforms in the detector on the West side. No one is working on this yet.

MT suggested that we might get one of the Nevis engineers out to FNAL to look at designing baffles or some such system to improve the air flow in the preamp boxes. LG will try and see if simple baffles work just to get some idea how the airflow may affect things. The temperature probes need to be moved into the air flow and decoupled from the heat sink on the side of the box. DH will ask Don Emory to do this.

LB reported that the KTY PO is in with some errors corrected. Chris Hays is boxing up parts (ed. note: the 10 boxes were taking to shipping on Friday afternoon). Chris Gregory at UTY could not get in touch with KTY during the week but did fax a list of guesses to the questions LB had sent. He thinks that print-fire-trim begins Sept 13-20, assembly is Sept 21-30 and testing starts October 1. They will need the 2^nd test jig by then which LB will ship directly to KTY. We should be able to get partial shipments and LG gave a list of preamps that we would like first (CC first then EC). We will get written reports on 1% of the production and they will test pass/fail the rest. There was som confusion on KTY's part on the specs for the A and C species which LB will correct them on as these are in the blue books they have already. KTY has requested a new setup disk for the new scope that they will use for testing that LB will send them - she needs to find a similar scope at the Computing Division.

LB has all the parts for H-test jig. The housing is still coming. She has not had time to assemble it yet and the suggestion was she give it to Bob Jones group. She will get together an assembly drawing.

We have all the quotes for the H-series and need to make a decision which will be done next week.

The four v3.2b preamp motherboards were taken to shipping on Friday afternoon to be sent to Chipco for assembly. We expect these back by Sept 14.