The plastic leaded chip carrier is used for packaging the SCA die.  SCAs will be placed on each side of the PC board.  The physical appearance is similar, but the electrical connections to the chip are mirrored and therefore can be piggy-backed.

One measurement which was not characterized extensively in the begining, because it was small and would be removed via software, was the output offset.  Presently we have a large number of packaged devices which have large offsets.  We currently do not understand the cause of this offset, but we are actively seeking a solution.