Mapping the SMT into the SMT hardware (or electronics) database

Naming conventions
Detector numbering schemes
Installation Instructions
Definition of the CAL ID bits
On Cal ID bits in F-disk and H-disk HDIs
Summary of SMT Components and their numbering

author: Freya Blekman, fblekman@fnal.gov, last modified April 30, 2001.

Naming conventions for the SMT hardware database.

Table name	Definitions			Comment
SMT_DAQ_SVX	SVX_SERIAL_NO=HDI_SERIAL_NO-i			see HDI_SERIAL_NO i=svx number (starts at 0)
SMT_DAQ_VRB	VRB_SERIAL_NO=VRB_XXYY	DESCRIPTION=VRB_XXYY	EPICS_NAME=SMT_VRB_XXyy	XX=crate ID (hex) YY=VRB no (dec) yy=VRB no (hex)
SMT_DAQ_SEQ	SEQ_SERIAL_NO=SEQ_PCXXYY	DESCRIPTION=SEQ_PCXXYY	EPICS_NAME=SMT_SEQ_PCXXYY	PC=PC number (03,04,19 or 20) XX =crate number (0A,0B,1A,1B) YY=SEQ number (hex)
SMT_DAQ_ADAPTER_CARD	ADAPTER_CARD_ID=adapter card ID			standard similar to 60X etc.
SMT_DAQ_INTERFACE	INTERFACE_SERIAL_NO=INT_LL_XXYY	DESCRIPTION=INT_LL_XXYY	EPICS_NAME=SMT_IB_LLXXYY	LL=quadrant (NW,SE,SW or NE) XX=crate number (0A,0B,1A,1B) YY=IB number (hex)
SMT_DAQ_HDI	HDI_SERIAL_NO=(B/F/H)X-l-x	DESCRIPTION=BX(N/S)-Ll-HDIx DESCRIPTION=FX(N/S)-Ll-HDIx-type(6/8) DESCRIPTION=HX(N/S)-Ll-HDIx		(B/F/H)=detector type. X=det number (for B, F, H) l=layer number for Barrel HDIs l=side for F-disk HDIs x=HDI number (N/S)=north/south SMT (6/8)= number of SVXs on HDI.
SMT_DAQ_VBD	VBD_SERIAL_NO=VBD_xx	DESCRIPTION=VBD_xx	EPICS_NAME=SMT_VBD_xxii	xx=crate number (hex) ii=locator in crate
SMT_DAQ_SEQC	SEQC_SERIAL_NO=SMT_SEQC_PCLL	DESCRIPTION=SEQC_PCLL	EPICS_NAME=SMT_SEQCR_PCLLRT	PC= PC number (19 or 20) LL = location (0A,0B,1A,1B) RT=position in crate
SMT_DAQ_VRBC	VRBC_SERIAL_NO=VRBC_n	DESCRIPTION=VRBC_n	EPICS_NAME=SMT_VRBC_xxii	xx=crate number (hex) ii=locator in crate n=VRBC number (= crate number - 0x60), decimal.
SMT_DAQ_INTERFACE_CRATE	CRATE_SERIAL_NO=SMT_INTCR_(SE/NE)_LL	DESCRIPTION=INT_CRATE_X=(SE/NE)_LL		LL=crate number (0a, 0b, 1a, 1b) (SE/NE)= Location X= crate number(decimal)
SMT_SEQ_CRATE	CRATE_SERIAL_NO=SMT_SEQ_CRATE_PCLL	DESCRIPTION=SEQ_CRATE_X=PCLL		PC=pc number (20 or 21?) LL=crate number (0a, 0B, 1A, 1B) X=crate number (decimal)
SMT_VRB_CRATE	CRATE_SERIAL_NO=SMT_VRBCR_xx	EPICS_NAME=SMTa_b	DESCRIPTION=VRBCR_xx	xx=crate number(hex), 60 and up. a=crate number (0 to 5) b= crate part (0/1)
SMT_SVX_CHIP	SVX_SERIAL_NO=HDI_SERIAL_NO-i			see HDI_SERIAL_NO i=svx number (starts at 0)

'

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Detector Numbering

for the numbering, I use the following schemes:

Software Scheme

north <---- H1 H2 F1 F2 F3 F4 B1 F5 B2 F6 B3 B4 F7 B5 F8 B6 F9 F10 F11 F12 H3 H4 ----> south

Hardware Scheme

north <---- H2N H1N F6N F5N F4N F3N B3N F2N B2N F1N B1N B1S F1S B2S F2S B3S F3S F4S F5S F6S H1S H2S ----> south

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Setting up the Database

All necessary files are in CVS, in the onl_smtcalib/oracle directory. please look at the following HTML document, which was originally written for the Database setup for the South half of the SMT.

I'm currently working on a more up-to-date version which describes the files currently in CVS. The draft version can be found in the following document.

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CAL ID numbers

Every HDI in the SMT has a distict, 12 bit number. The numbering scheme is the following:

HDI Calibration Mapping.

How to get all info into 12 bits:

BIT

comments

Numbers required

F-disk HDIs

aaa=barrel# (8 values)

H-disk HDIs

bbb=barrel layer #
(16 values)

8
(2 for f-disk and h-disk)

Barrel HDIs

ffff = f-disk # (16 values)

hhh = H-disk # (8 values)

c's= hdi numbers;

4 bits for barrel layer(=16)

6 or 12 required

5 bits for f fdisk (=32)

7 bits for h disk (=128)

note:all numbers start counting at 1!!

Comments

The barrels are split up in 8 layers (which are essentially 4 layers, which each are split into an inner and an outer layer.)
everything necessary to create the sql files that setup the Database are in CVS, in the onl_smtcalib/oracle package.

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On Cal ID bits in F-disk HDIs

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The numbering in Hardware and Software schemes is different for F-disks. In the software, Meenaksi Narain's definitions are used. This scheme is a bit different for the hardware numbering schemes, which work with layers instead of views.

For compatibility reasons, the CAL_ID variable follows the software scheme. which means that:

I've changed the previous CAL_ID scheme and added a layer number to the h-disks!!!!!
In F-disk numbering:
- CAL_ID uses the f-disks view, the p-side (8-chip-HDIs) are always in Layer(=view) 1, the n-side (6-chip-HDIs) are always in Layer (=view) 2.
- The Hardware scheme runs from HDI 1 to 12 in Layer 1, and then again from 1 to 12 in Layer 2. 8- and 6 chippers are mixed in the layers. Depending on the layer number and the f-disk number, either the odd or even numbered HDIs are 8-or 6-chippers. I will eventually add a table which is which on what disk.
In H-disk numbering:
- CAL_ID uses a numbering scheme similar to the F-disks. View 1 are all 'outer' H-disk HDIs, which is equivalent to the 'layer' number in the CAL_ID. 'outer' in this case refers to the fact that these HDIs are facing away from the cooling ring, unlike the 'inner' HDIs in view 2, that are facing towards the cooling ring.
- For H-Disks: The hardware numbering scheme is identical to the software numbering scheme.

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Summary Table for SMT NUMBERING:

Detector	Comment	SOFTWARE SCHEME	HARDWARE SCHEME
Barrels	Contain Layers of silicon detectors	Barrels contain 8 layers, layers 1, 2, 5 and 6 contain one type of silicon microstrip detector, layers 3, 4, 7 and 8 contain another type. Odd numbered layers are facing opposite to even-numbered layers. The views in the even layers are called 'outer' and in the odd layers 'inner', referring to the direction the active side of the silicon is facing.
outer Barrels	The two barrels furthest from the beamcrossing contain single-sided 3-chip HDI detectors in layers 1, 2, 5 and 6. Double-sided 9-chip HDIs in all the other layers.	Called Barrel 1 and 6, where Barrel 1 is northernmost.	Called Barrel 3 North and Barrel 3 South.
inner Barrels	The four central barrels contain double-sided 6-chip detectors in layers 1, 2, 5 and 6. Layers 3, 4, 7 and 8 contain double-sided 9-chip HDIs	Called Barrel 2, 3, 4 and 5, where Barrel 2 is northernmost and the interaction region (z=0) is between barrels 3 and 4	Called B2N, B1N, B1S and B2S, where the barrel numbering increases when moving away from the interaction point. z=0 is where B1N and B2S meet.
F-disks	F-disks consist of 12 double-sided f-wedges. The 2 sides of the wedges are read out seperately, one side is instrumented by 8 svx chips, the other by 6 svx chips. The HDIs reading out the two sides are commonly referred to as 6-chippers and 8-chippers.The Bias voltage for the active silicon is supplied via the 6-chip HDIs. 8-chippers do not supply voltage to the detector. The HDIs in f-disks are numbered in their rotational orientation. F-disks are read out in two layers. The definition of these layers is different in the hardware and software scheme. This has an implementation readout schemes.	Hardware numbering starts at the detector which cable exits the detector at 12 o'clock (at the positive x-axis) and then continues with an HDI of the opposite kind, thus varying until all HDIs are covered. The layers are defined as the f-wedges on either side of the cooling ring. Each layer contains 6 8-chippers and 6 6-chippers	Software numbering distinguishes between 6-chippers and 8-chippers. All the 8-chippers (which is the p-side of the silicon), face away from the cooling ring and are all part of view 1. The 6-chippers (n-side) are all in view 2, facing towards the cooling ring.
F-disk rotations	Disks are rotated around the beamline (=z-axis) to supply maximal coverage.This has an implementation readout schemes, as the 'first' HDI might differ per f-disk.	In F-disks 1, 2, 10 and 12 (=F6N, F4N, F4S and F6S in hardware numbering), Layer 1 starts with a 6-chipper, and layer 2 starts with an 8-chipper. In all other disks, Layer 1 starts with an 8-chipper and Layer 2 with a 6-chipper.	Layer 1, also known as View 1, consists of 8-chippers only, and starting to count at the first 8 chipper found when rotating from the x-axis down, clockwise in the x-y plane. View 2 (or layer 2) is defined the same, but for 6-chip HDIs.
H-disks	H-disks consist only of single-sided, 6 chip HDIs. Two of these are glued against each other, with a stereo angle, to create 3D measurement. One H-disk consists of 24 pairs of glued HDIs.	The numbering schemes for Hardware and software are Identical here, except for the North-South split in disk numbering. All the HDIs facing towards the cooling ring are part of layer (or view) 1, the HDIs facing outwards are part of view (layer) 2. The counting starts yet again at the positive x-axis.

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Mapping the SMT into the SMT hardware (or electronics) database

Contents

Naming conventions for the SMT hardware database.

Table name

Definitions

Comment

Detector Numbering

Software Scheme

Hardware Scheme

Setting up the Database

CAL ID numbers

Comments

On Cal ID bits in F-disk HDIs

Summary Table for SMT NUMBERING:

Detector

Comment

SOFTWARE SCHEME

HARDWARE SCHEME