Note from Marvin (24 Nov.) about matching of Si sectors to CFT sectors: I will describe the latest ideas for the SVT processor. The trigger sector is 4.5 degrees. This must somehow match into the 15 degreee sectors of the SVT. The proposal made at NIU was to compress the trigger information into 8 sectors of 45 degrees each so that they could be sent to L2 and to the AND-OR network for the L1 trigger. AT NIU this system used the backplane of the front end crates and some daughter boards. It makes much more sense to do this compression in a separte crate. I had planned on doing a 5 to 1 compression and then another 2 to 1. This still makes sense but we will now try to put it on one board. Note that it is not certain that it will fit on one board. If this is successful, then we have all the information for a 45 degree wedge on one board. This information normally goes to the L1 AND-OR generator and to an MBT if there is a L2 accept. But it also contains all the information needed for the SVT. Thus, I suggest that we implement a 4 way split of the fiber that goes to the MBT and send one fiber to each of the 3 SVT sector processors (three 15 degree sectors per 45 degree one). Barsotti's group has measured the signal loss in a 4 way split and it is around -8.5 dbm. D0 has an informal spec of -9 dbm and the Finnesar low limit is -13 dbm. Bit error rates increase sharply as one goes towards the -13 dbm limit. -9 dbm looks ok in tests done at the CD but we may need to increase the optical power from 0 dbm to 1 or 2 dbm to get additional noise margin. Each SVT sector trigger will get a lot more information than it needs. However, the window comparator on each SVX readout fiber is designed to only store roads that intersect its ladders. The rest of the information is discarded. While it is true that 3 times as much information is thrown away, it should have no affect on the original design. Everything should work. Cracks are exclusively a problem for the silicon. By the time the data reaches the compression card, the road is in one or another of the fiber sectors even if it projects into a different silicon sector, i.e., a silicon sector that is not below a given 45 degree wedge. This is not the case for the silicon. A track can have a road that spans two sections or even is in a completely different section. The best way to handle this is to split the SVX readout signal into 3 and send the same data to sectors on both sides of the crack. Then the there is no difference between an edge track and one in the middle - the same hardware can process everything. Alternatively, one could think of sending data across the trigger backplane but this will require a special section on the trigger boards. Also, it is likely that sometimes the crack will span crates which will then require a special board. It will likely be simpler and cheaper to build more receiver boards. We may want to ignore sections where the overlap is small such as the areas where the silicon detectors overlap. Note that because there are positive and negative tracks, data must be sent to both ways; one cannot just go in one direction. The main thing that this does to the fiber tracker is to require a board that processes 10 sectors at a time. There is no special part for SVT. Tracks are selected for transmission to L2 and sent out over the fiber optic line. The SVT simply gets this information and uses it for track roads. It is possible that the SVT will require more information than L2 would. In that case, the larger data set will need to be transmitted.